Marc Tudela
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Former Member
marc.tudela@upf.edu
51.017
(+34) 93 542 1578
Marc studied Electronic Engineering at Universistat Politècnica de Catalunya, and received his diploma in 2013. From February 2014 to July 2017 he was working as a power electronics engineer in Cinergia. Since September 2017 he was at BERG, first as a support engineer and then, since October 2018, as a PhD student. The main focus of his research is the transfer of electric power by means of galvanic coupling.
He received a MSc in Biomedical Engineering at the Universitat de Barcelona in 2019.
Publications with BERG
“Powering Electronic Implants by High Frequency Volume Conduction: In Human Validation”, IEEE Transactions on Biomedical Engineering, vol. 70, no. 2, pp. 659-670, 2023. (1.94 MB) ,
“Floating EMG Sensors and Stimulators Wirelessly Powered and Operated by Volume Conduction for Networked Neuroprosthetics”, Journal of NeuroEngineering and Rehabilitation, vol. 19, p. 57, 2022. ,
“Wireless networks of injectable microelectronic stimulators based on rectification of volume conducted high frequency currents”, Journal of Neural Engineering, vol. 19, p. 056015, 2022. (1.9 MB) ,
“Volume Conduction for Powering Deeply Implanted Networks of Wireless Injectable Medical Devices: a Numerical Parametric Analysis”, IEEE Access , vol. 9, pp. 100594-100605, 2021. (1.16 MB) ,
“Power Transfer by Volume Conduction: In Vitro Validated Analytical Models Predict DC Powers above 1 mW in Injectable Implants”, IEEE Access, vol. 8, no. 1, pp. 37808-37820, 2020. (1.27 MB) ,
“Injectable Sensors Based on Passive Rectification of Volume-Conducted Currents”, IEEE Transactions on Biomedical Circuits and Systems, vol. 14, no. 4, pp. 867-878, 2020. ,
“Powering Implants by Galvanic Coupling: A Validated Analytical Model Predicts Powers Above 1 mW in Injectable Implants”, in World Congress on Medical Physics and Biomedical Engineering 2018. IFMBE Proceedings, Prague, Czech Republic, 2018, vol. 68/3, pp. 23-26. (272.06 KB) ,
“Two-Port Networks to Model Galvanic Coupling for Intrabody Communications and Power Transfer to Implants”, in 2018 IEEE Biomedical Circuits and Systems Conference (BioCAS), 2018, pp. 407-410. (590.36 KB) ,