Marc Tudela
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Former Member
marc.tudela@upf.edu
51.017
(+34) 93 542 1578
Marc studied Electronic Engineering at Universistat Politècnica de Catalunya, and received his diploma in 2013. From February 2014 to July 2017 he was working as a power electronics engineer in Cinergia. Since September 2017 he was at BERG, first as a support engineer and then, since October 2018, as a PhD student. The main focus of his research is the transfer of electric power by means of galvanic coupling.
He received a MSc in Biomedical Engineering at the Universitat de Barcelona in 2019.
Publications with BERG
“Floating EMG Sensors and Stimulators Wirelessly Powered and Operated by Volume Conduction for Networked Neuroprosthetics”, Journal of NeuroEngineering and Rehabilitation, vol. 19, p. 57, 2022. ,
“Powering Electronic Implants by High Frequency Volume Conduction: In Human Validation”, IEEE Transactions on Biomedical Engineering, vol. (Early Access), 2022.
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“Wireless networks of injectable microelectronic stimulators based on rectification of volume conducted high frequency currents”, Journal of Neural Engineering, vol. 19, p. 056015, 2022.
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“Volume Conduction for Powering Deeply Implanted Networks of Wireless Injectable Medical Devices: a Numerical Parametric Analysis”, IEEE Access , vol. 9, pp. 100594-100605, 2021.
(1.16 MB) ,

“Power Transfer by Volume Conduction: In Vitro Validated Analytical Models Predict DC Powers above 1 mW in Injectable Implants”, IEEE Access, vol. 8, no. 1, pp. 37808-37820, 2020.
(1.27 MB) ,

“Injectable Sensors Based on Passive Rectification of Volume-Conducted Currents”, IEEE Transactions on Biomedical Circuits and Systems, vol. 14, no. 4, pp. 867-878, 2020. ,
“Powering Implants by Galvanic Coupling: A Validated Analytical Model Predicts Powers Above 1 mW in Injectable Implants”, in World Congress on Medical Physics and Biomedical Engineering 2018. IFMBE Proceedings, Prague, Czech Republic, 2018, vol. 68/3, pp. 23-26.
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“Two-Port Networks to Model Galvanic Coupling for Intrabody Communications and Power Transfer to Implants”, in 2018 IEEE Biomedical Circuits and Systems Conference (BioCAS), 2018, pp. 407-410.
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